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多壁碳纳米管湿度传感器频率特性(英文)

Frequency Properties of Multi-Walled Carbon Nanotube Humidity Sensor
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摘要 为了研究测试频率对传感器性能的影响,改善多壁碳纳米管(multi-walled carbon nanotubes,MWCNTs)湿度传感器检测方法并提高传感器检测精度,对传感器频率特性进行了分析.在玻璃衬底上利用蒸镀和光刻技术制作了叉指电极,在电极表面涂敷了MWCNTs-SiO2敏感薄膜,最后通过烧结完成传感器制作.利用饱和盐溶液法产生相应湿度值,并使用RCL自动测试仪对传感器进行测试,测试频率选择在1 kHz到500 kHz之间.对传感器频率特性进行了实验与理论分析,结果表明,该传感器电容值对环境湿度敏感,并且其敏感特性受传感器检测频率的影响.使用毛细凝聚理论以及电解质物理理论对上述实验现象进行了合理的解释.传感器静态电容以及对湿度的灵敏度均随着测试频率的增加明显降低,测试频率为500 kHz时传感器灵敏度仅为测试频率1 kHz时的0.24倍. To study the effect of the testing frequencies on sensor properties,and to improve the measuring method and the properties of the multi-walled carbon nanotubes(MWCNTs) humidity sensor,the frequency properties of the sensor were studied.Interdigital electrodes were made on the glass substrate by evaporation and photolithography,then a layer of MWCNTs-SiO2 mixture was coated on the electrodes,at last the sensor was nodulized in vacuum circumstance.The controlled relative humidity(RH) environments were achieve...
出处 《纳米技术与精密工程》 EI CAS CSCD 2010年第4期285-289,共5页 Nanotechnology and Precision Engineering
关键词 碳纳米管(CNTs) 湿度传感器 频率特性 毛细凝聚现象 介电常数 carbon nanotubes(CNTs) humidity sensor frequency properties capillary condensation dielectric constant
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  • 1李晓韬,齐明.湿度测量细分解[J].企业标准化,2005(7):29-30. 被引量:1
  • 2李艳宁,唐洁,饶志军,傅星,胡小唐.微悬臂梁谐振技术检测溶液粘度的研究[J].压电与声光,2005,27(5):572-574. 被引量:2
  • 3李艳宁,赵倩云,王忠顺,房轩,宋丽薇,李树民,傅星,胡小唐.压电探针应用于原子力显微镜液体成像的研究[J].西安交通大学学报,2006,40(3):341-343. 被引量:6
  • 4张保庭,温斌,李廷举.磷对CVD法制备碳纳米管纯度及形貌的影响[J].纳米技术与精密工程,2006,4(4):261-265. 被引量:1
  • 5MASON A, YAZDI N, CHAVAN A V, et al.. A generic multi-element microsystem for portable wireless applications [C]. Proc. IEEE, 1998,86: 8.
  • 6RITTERSMA Z M. Recent achievements in miniaturised humidity sensors-a review of transduction techniques[J]. Sens. and Actuators A, 2002,96: 196-210.
  • 7FUJITA T, MAENAKA K. Integrated multi-environmental sensing system for the intelligent data carrier [J]. Sensors and Actuators A. Physical, 2002,97-98(1) :527-534.
  • 8DEHENNIS A, WISE K D. An all-capacitive sensing chip for temperature, absolute pressure, and relative humidity [C]. Proc. of the 12th Interna tional Conference on Solid-State Sensors and Actu ators (Transduce'03) , Boston, 2003: 1860-1863.
  • 9PAN C T, CHENG P J, CHEN M F, et al.. Intermediate wafer level bonding and interface behavior[J]. Microelectronics Reliability, 2005,45 : 657-663.
  • 10WIEMER M, JIA C P, TOEPPER M, et al.. Wafer bonding with BCB and SU-8 for MEMS packaging, [C]. Proc. of the Electronics System integra tion Technology Conference, Dresden, Germany, 2006:1401-1405.

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