Modification of residual stress in Al-[AlBO]_w/Al compound plate

The application of compound parts of Al [AlBO] w/Al not only reduces the cost of the parts but also improves its properties. However, there is a large thermal residual stress between Al and [AlBO] w/Al, and it is harmful for practical application. From the theoretical analyses and experimental results, it was found that by the compressive pre plastic deformation perpendicular to the interface between Al and [AlBO] w/Al, the interlayer residual stress of compound parts can be reduced, while the mechanical properties of compound parts can be improved. [

The residual stress in a 20%SiC w/6061Al composite as extruded was investigated by using X ray stress measurement method. It was found that, high residual stress existed in the composite and residual stress distribution in each direction are not uniform. Relaxation process of residual stress in the composite was dynamically measured during annealing at high temperature. It is verified that the relaxation of residual stress obeys the power law at high temperature. With the creep mechanism, the relaxation behavior of residual stresses at high temperature was analyzed. The results show that, the stress exponent and activation energy for stress relaxation of the composite are obviously higher than those of the matrix alloy.