Evolution of microstructure and dimension of as-molded parts during thermal removal process of wax-based MIM binder

The evolution of the microstructure and the dimension of as molded parts were studied on the basis of the thermogravimetric analysis of wax based MIM binder. The results show that the binder removal speeds are different in different temperature ranges during binder removal process. The evolution of the microstructure of as molded parts during binder removal process clearly showed the initiation and formation of connected pore structure, which is the removal channel of the binder. The as molded parts almost continuously shrank through binder removal process, except an expansion stage during 320～440 ℃, which is the dissolution expansion effect due to the dissolution of V PW in the polymer melt. [

The evolution of the microstructure and the dimension of as-molded parts were studied on the basis of the thermogravimetric analysis of wax-based MIM binder. The results show that the binder removal speeds are different in different temperature ranges during binder removal process. The evolution of the microstructure of as-molded parts during binder removal process clearly showed the initiation and formation of connected pore structure, which is the removal channel of the binder. The as-molded parts almost continuously shrank through binder removal process, except an expansion stage during 320 similar to 440 degreesC, which is the dissolution expansion effect due to the dissolution of V-PW in the polymer melt.