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Molecular Dynamics Simulation of Dealloyed Layer-induced Tensile Stress in Cu_3Au

Molecular Dynamics Simulation of Dealloyed Layer-induced Tensile Stress in Cu_3Au
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摘要 During stress corrosion cracking of Cu3Au alloy, there is a dealloyed layer on its surface because of preferential dissolution of Cu, and there is a linear distribution of Cu vacancy concentration in the dealloyed layer. Molecular dynamics simulation has been done on the three-dimensional crystal (about 148 000 atoms) by employing the embedded-atom method (EAM) potential. Simulation shows that Cu3Au crystal in which there is a dealloyed layer on one surface and one end is fixed will be deflected after relaxing for a long time because of a tensile stress generated at or near the dealloyed layer interface. The deflection and then the tensile stress increase with increasing the depth of dealloyed layer and the vacancy concentration in the dealloyed layer. During stress corrosion cracking of Cu3Au alloy, there is a dealloyed layer on its surface because of preferential dissolution of Cu, and there is a linear distribution of Cu vacancy concentration in the dealloyed layer. Molecular dynamics simulation has been done on the three-dimensional crystal (about 148 000 atoms) by employing the embedded-atom method (EAM) potential. Simulation shows that Cu3Au crystal in which there is a dealloyed layer on one surface and one end is fixed will be deflected after relaxing for a long time because of a tensile stress generated at or near the dealloyed layer interface. The deflection and then the tensile stress increase with increasing the depth of dealloyed layer and the vacancy concentration in the dealloyed layer.
出处 《Journal of University of Science and Technology Beijing》 CSCD 2001年第4期295-298,共4页 北京科技大学学报(英文版)
基金 This work was financially supported by the NNSF(No.59872004) the Special Funds for the Major State Basic Research Projects(No
关键词 dealloyed layer-induced stress molecular dynamics simulation Cu3Au dealloyed layer-induced stress molecular dynamics simulation Cu3Au
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参考文献4

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