摘要
本文从应用的观点出发简要介绍了各种封装技术在新世纪中的发展趋势。论述了如CSP、BGA 及倒装芯片等先进封装技术在微电子工业中所发挥的重要作用。
The future trend of different types of packaging in the new era is concisely introduced in this pa- per from a viewpoint of applications.And the important role of advanced packagings such as CSP,BGA and Flip-chip technology in the microelectronics is described as well.
出处
《电子与封装》
2001年第2期6-10,共5页
Electronics & Packaging
关键词
封装技术
微电子
系统级芯片
Packaging technologies
Microelectronics
System on-chip
