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Study on Homogeneous Particleboard of Wheat Straw

Study on Homogeneous Particleboard of Wheat Straw
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摘要 In the paper homogeneous particleboard of wheat straw is researched. The result shows the technology of homogeneous particleboard from cost and quality. The moisture content of straw particle is 2.0%~2.5 %. The temperature of hot-pressing is 150℃. The time of hot-pressing is 48 sec/mm ( panel thickness). The ratio between MDI and UF is 0.40. The glue content for surface layer of wheat straw particle is 10% (MDI 2.86%, UF 7.14%). The glue content for core layer of wheat straw particle is 8% (MDI 2.29%, U... In the paper homogeneous particleboard of wheat straw is researched. The result shows the technology of homogeneous particleboard from cost and quality. The moisture content of straw particle is 2.0%~2.5 %. The temperature of hot-pressing is 150℃. The time of hot-pressing is 48 sec/mm ( panel thickness). The ratio between MDI and UF is 0.40. The glue content for surface layer of wheat straw particle is 10% (MDI 2.86%, UF 7.14%). The glue content for core layer of wheat straw particle is 8% (MDI 2.29%, UF 5.71%). The panel density is 0.75 g /cm3.
出处 《Chinese Forestry Science and Technology》 2003年第1期60-65,共6页 中国林业科技(英文版)
关键词 wheat straw homogeneous particleboard MDI UF wheat straw, homogeneous particleboard, MDI, UF
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