表贴塑封器件的老炼方法初步研究

Preliminary study of burn-in method for surface mounted and plastic encapsulated device

目前在高可靠性应用领域里已开始有限地选用工业级表贴塑封器件。为提高整机的可靠性,需要对表贴塑封器件进行可靠性筛选,而老炼是其中至关重要的环节。相比比较成熟的直插器件的老炼方法而言,表贴塑封器件老炼尚有一些问题需要进一步研究与探讨。文章对表贴塑封器件与直插器件老炼过程中的结温控制方法进行了比较与分析,指出了两者结温控制的主要区别。基于此,提出基于等效热阻估算及结合器件壳温控制结温的表贴塑封器件老炼试验方法,对包括SC-75、UCSP等封装的元器件进行了老炼试验和测试。筛选后的元器件已应用于工程实践,并通过了一系列的试验考核。

Industry-level surface mounted and plastic encapsulated devices are restrictedly used in the area of high reliability applications.In order to improve the unit reliability,the screening procedures of surface mounted and plastic encapsulated devices are needed,among which the burn-in test is a key part.The burn-in test method for line package devices is now a mature technique,but there are still some problems to be studied for surface mounted and plastic encapsulated devices.In this paper,the differences of junction temperature control methods between the surface mounted plastic encapsulated devices and the line package devices are analyzed.A burn-in test method for the surface mounted and plastic encapsulated devices is then proposed.The junction temperature control is based on the case temperature control and the equivalent thermal resistance value estimation and the burn-in tests were carried out for SC-75 and UCSP packages.These post-screening packages have been applied in practice.