SiCp/Al电子封装复合材料预成形坯的制备

Preparation of SiCp/Al Electronic Packaging Composite Preforms

在本实验中将SiC颗粒与粘结剂混合,温压制备成坯块,进行了热脱脂与预烧结,研究了热脱脂一预烧结后坯块的线性膨胀率、孔隙度、强度与工艺条件的关系,对预成形坯的显微组织形貌进行分析.结果表明,通过有效地控制成形、脱脂与烧结等工艺参数,能制备出具有适合强度和孔隙度的预成形坯.

SiCp and binder were mixed together and SiCp preforms were prepared by warm pressing, thermal debinding and pre-sintering. The relations of the performances such as size variation, porosity and strength of the performs with process parameters were investigated. The microstructure of the performs was observed by SEM. The results show that SiCp preforms with suitable strength and porosity for preparing SiCp/Al composites can be obtained by controlling effectively the process parameters such as compaction, debinding and pre-sintering.