摘要
针对沉金工艺的PCB板,研究了板面金厚分布的规律,同时研究了金厚0.03 m产品的可靠性,进而对金厚的0.03 m板的金厚通过统计控制方法计算设定控制限进行控制,已达到成本控制的目的。
This article focused on the PCB of ENIG process,made research the law of distribution of gold thickness on the board.At the same time,we researched the reliability of PCBs with 0.03 mm gold thickness.And then we set control limit to the Flash Gold PCB's gold thickness though the method of SPC,in order to achieve the purpose of cost control.
出处
《印制电路信息》
2012年第8期47-54,共8页
Printed Circuit Information
关键词
薄金
金厚分布
可靠性
控制限
Flash Gold
Distribution of Gold Thickness
Reliability
Control limit
