摘要
对两种不同添加剂镀液在通孔和盲孔电镀过程深镀能力的研究,说明其各自对于通孔和盲孔电镀的优势所在。并确定对于通孔和盲孔同步电镀镀液添加剂的选择。
In this paper,the two different bath additives deep plating abilities for the PTH hole and blind hole electroplating process were studied with the different advantages.It also concluded the choices for the PTH hole and blind hole synchronous electroplating bath additives choice.
出处
《印制电路信息》
2012年第10期44-46,共3页
Printed Circuit Information
关键词
添加剂
通孔
盲孔
深镀能力
additive
PTH hole
blind hole
deep plating capability
