任意层互连技术应用研究

Application research of any layer interconnect technology

任意层互连技术是目前高密度互连印制电路板领域新的工艺技术,通过微孔来实任意层与层之间的连接。本文主要介绍了任意层互连技术的应用进展,分析了电镀、导电膏及铜凸块三种微孔互连技术,同时,描述了各任意层互连方法的工艺技术流程,并对其进行了对比分析。

Any layer interconnect technology is the latest technology in the field of high density interconnect printed circuit board,which achieves the connection between any layers by microvia.In this paper,the application progress of any layer interconnect technology was introduced,three methods making microvia: plating,conductive paste,and copper bumps were told,as well as methods to achieve any layer interconnect process,and the analysis between them.