摘要
介绍了汽相再流焊的主要工艺特点,分析了汽相再流焊片式元件容易立碑的原因及控制方法,并对温度曲线加热因子与金属间化合物层厚度和焊点组织的关系进行了研究。
This article describes the characteristic of vapor phase reflow soldering process. Then the causes of tombstoning when soldering chip components by the vapor phase reflow soldering is analyzed, and the controlling method is proposed. What’s more, this paper studies on the relationship between the heating factor of temperature profile and the thickness of inter-metallic compound layer and the microstructure of the solder joints.
出处
《航天制造技术》
2013年第3期38-40,共3页
Aerospace Manufacturing Technology
关键词
汽相再流焊
温度曲线
立碑
加热因子
金属间化合物
vapor phase reflow soldering
temperature profile
tombstoning
heating factor
inter-metallic compound
