摘要
研究了电场对超声振动辅助的Sn2.5Ag0.7Cu0.1RE/Cu润湿适配性的影响。结果表明,电场能够提高超声振动辅助的Sn2.5Ag0.7Cu0.1RE钎料合金在铜板上的润湿性;与不加电场相比,在温度270℃,电场强度1.5 kV/cm,电场作用时间60 s条件下,电场促进了超声振动辅助钎料润湿过程Cu原子的扩散,使钎料铺展面积提高20%,润湿角减小20.4%。
Effect of electric field on Sn2.5Ag0.7Cu0.1RE/Cu wettability with ultrasonic vibration assisted was investigated in the study. The results showed that electric field could improve the wetability of Sn2.5Ag0.7Cu0.1RE solder alloy on Cu substrate. The application of electric field could promote the diffusion of Cu atoms during the wetting process of the solder alloy. Compared with the sample obtained without electric field applied, the spreading area of solder alloy increased by 20%, and the wetting angle decreased by 20.4% under soldering temperature of 270 ℃, electric field of 1.5 kV/cm, electric field time of 60 s.
出处
《焊接技术》
北大核心
2013年第10期7-9,4,共3页
Welding Technology
基金
国家自然科学基金(50774029)
河南省高校科技创新团队支持计划
