添加剂对MSA电镀锡镀层性能的影响研究

Effect of Additives on Methyl Sulfuric Acid Salt Tin Deposition

采用电化学测试技术分析了添加剂对甲基磺酸盐(MSA)镀锡镀层电化学性能的影响,并通过扫描电镜分析了添加剂对镀层表面形貌的影响。结果表明,当加入添加剂时,镀层变得致密有规则。当添加剂的添加量为25 g/L时,添加剂浓度为25 mL/L时,腐蚀电位较低,腐蚀电流最小,线性极化电阻最大。在此浓度条件下,阴极极化能力最强,锡离子的析出电位最高,得到的镀层结晶最细致,镀层性能达到最优。

This article analyzes effects of additive on the electrochemical performance and surface topography of methyl sulfuric acid salt( MSA) tin deposition by adopting electrochemical measurement and scanning electron microscopy( SEM). The results showed that, when adding additive to the electroplating solution, the tin coating became compact and well-regular. When the additive amount was 25 g / L and the additive concentration was 25 mL / L, the corrosion potential and current located at lower position and the linear polarization resistance reached to the maximum. Under this concentration condition, the polarizing capability of cathode was best powerful, the deposition potential of the tin ions was the maximum, the coating crystals were finest and coating performance attained splendidly.