Anand模型预测63Sn37Pb焊锡钎料的应力应变行为

STRESS-STRAIN BEHAVIORS OF 63Sn37Pb SOLDER SIMULATED BY ANAND MODEL

通过在温度 3 13K～ 3 98K、应变率 10 - 3% s～ 10 % s内的一系列恒应变率拉伸实验 ,研究 63Sn3 7Pb焊锡钎料的力学行为 ,发现该材料的应力应变关系与温度和应变率有很大的相关性。采用统一型Anand粘塑性本构方程对该材料在较大温度和应变率范围内的应力应变行为进行数值模拟。结果表明Anand粘塑性方程可以有效地描述 63Sn3 7Pb焊锡钎料在 10 %应变下的温度和应变率相关粘塑性本构行为。

A series of tensile experiments at strain rates between 10 -3 %/s and 10%/s and at elevated temperatures between 313*!K～ 398*!K were conducted on 63Sn37Pb solder. Based on the experimental data the mechanical behavior of this material was investigated and found to have strong dependence on both test temperature and strain rate. Anand model, a unified visco-plasticity model was employed to simulate the stress strain curves under different temperatures and strain rates. The simulation results showed that Anand model could effectively predict 63Sn37Pb solder's stress-strain behavior up to strain amplitude of 10%.