集成芯片LED场地照明灯新型叠片散热器热分析

Thermal Analysis of High Mast Integrated LED Lamp with New Heatsink Structure of Laminated Pure Aluminum Plate

针对大功率LED场地照明集成芯片散热问题,提出了一种新型散热器结构。该散热器利用高导热纯铝材料,采用叠片的方式成型。采用实验和有限元模拟相结合的研究方法,对包括直流电源的新型叠片式LED散热器的散热性能进行了研究。结果表明:LED电源达到稳态所需时间较长,最终能够稳定在一个较低的温度范围。叠片式纯铝散热器通过增加散热面积和提高散热器材料的导热系数能有效降低LED结温。所设计的散热器和选择的电源在自然对流条件下能够很好地满足250 W大功率LED散热要求。

A new heatsink structure of laminated high heat conductivity pure aluminum plate was proposed for the thermal management of high power integrated LED for high mast lighting. An investigation of experiment and finite element simulation was carried out for the demonstration of the heat dissipation performance. The transient process of LED drive is longer and the steady state temperature is within the range of required operation temperature. The LED junction temperature can be effectively decreased due to the increasing of the heat dissipation area. The experiment results show that the designed heatsink and selected LED drive can satisfy the heat dissipation requirement of 250 W high power high mast lamp.