摘要
COB封装方式凭借无眩光、成本低、热阻小等优异性能,逐渐成为大家关注的热点,各项研究层出不穷。其报道大多着眼于如何进行有效的热管理,如通过软件模拟,得出不同芯片间距下热阻值的差异等,而关于这些差异在实际应用中影响程度如何,则鲜见报道。本文从实际出发,结合LED封装器件通用的试验方法,对比分析优劣两种方案,直观地反映了不同的基板镀层、固晶胶种类、热管理方案、封装工艺对流明维持率及产品稳定性的影响,为COB研发人员提供了参考。摘要:
More and more persons pay attention to COB(Chip on Board) because of its excellent performance, such as no glare, low cost and low thermal resistance. Most of the researchers focus on how to achieve effective thermal management. For example, they realized that multi-chip COB LEDs with different chip gaps had different thermal resistance values through software simulation. But there have been few reports on these differences' effects in actual applications. In this paper, we explain the advantages and disadvantages of different kinds of solutions from a practical point of view which has been combined with the general LED test methods. The results show that the comparison could directly refl ect how much the factors such as substrate's metal coating, kinds of adhesive, thermal management methods and packaging technology contribute to the products' lumen maintenance and stability. The conclusion will provide a reference for COB researchers.
出处
《中国照明电器》
2014年第4期19-22,共4页
China Light & Lighting
