盲孔镀铜过程中添加剂的作用研究
Functions of the additives in microvia filling by copper electrodeposition
摘要
熟悉盲孔镀铜配方中各种添加剂的作用,对理论研究和实际生产都具有重要的意义。文章以一种常见的镀铜配方为例,借助金像显微镜和循环伏安溶出法(CVS)详细研究了配方中各种添加剂的作用。
熟悉盲孔镀铜配方中各种添加剂的作用,对理论研究和实际生产都具有重要的意义。文章以一种常见的镀铜配方为例,借助金像显微镜和循环伏安溶出法(CVS)详细研究了配方中各种添加剂的作用。
出处
《印制电路信息》
2012年第S1期281-286,共6页
Printed Circuit Information
关键词
盲孔镀铜
循环伏安溶出法
填孔效果
Microvia Filling by Copper Electrodeposition
Cyclic Voltammetric Stripping
Filling Performance
参考文献10
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