期刊文献+

Fabrication of metal suspending nanostructures by nanoimprint lithography(NIL) and isotropic reactive ion etching(RIE)

Fabrication of metal suspending nanostructures by nanoimprint lithography(NIL) and isotropic reactive ion etching(RIE)
原文传递
导出
摘要 We report herein a rational approach for fabricating metal suspending nanostructures by nanoimprint lithography(NIL) and isotropic reactive ion etching(RIE).The approach comprises three principal steps:(1) mold fabrication,(2) structure replication by NIL,and(3) suspending nanostructures creation by isotropic RIE.Using this approach,suspending nanostructures with Au,Au/Ti or Ti/Au bilayers,and Au/Ti/Au sandwiched structures are demonstrated.For Au nanostructures,straight suspending nanostructures can be obtained when the thickness of Au film is up to 50 nm for nano-bridge and 90 nm for nano-finger patterns.When the thickness of Au is below 50 nm for nano-bridge and 90 nm for nano-finger,the Au suspending nanostructures bend upward as a result of the mismatch of thermal expansion between the thin Au films and Si substrate.This leads to residual stresses in the thin Au films.For Au/Ti or Ti/Au bilayers nanostructures,the cantilevers bend toward Au film,since Au has a larger thermal expansion coefficient than that of Ti.While in the case of sandwich structures,straight suspending nanostructures are obtained,this may be due to the balance of residual stress between the thin films. We report herein a rational approach for fabricating metal suspending nanostructures by nanoimprint lithography (NIL) and isotropic reactive ion etching (RIE). The approach comprises three principal steps: (1) mold fabrication, (2) structure replication by NIL, and (3) suspending nanostructures creation by isotropic RIE. Using this approach, suspending nanostructures with Au, Au/Ti or Ti/Au bilayers, and Au/Ti/Au sandwiched structures are demonstrated. For Au nanostructures, straight suspending nanostructures can be obtained when the thickness of Au film is up to 50 nm for nano-bridge and 90 nm for nano-finger patterns. When the thickness of Au is below 50 nm for nano-bridge and 90 nm for nano-finger, the Au suspending nanostructures bend upward as a result of the mismatch of thermal expansion between the thin Au films and Si substrate. This leads to residual stresses in the thin Au films. For Au/Ti or Ti/Au bilayers nanostructures, the cantilevers bend toward Au film, since Au has a larger thermal expansion coefficient than that of Ti. While in the case of sandwich structures, straight suspending nanostructures are obtained, this may be due to the balance of residual stress between the thin films.
出处 《Science China(Technological Sciences)》 SCIE EI CAS 2009年第5期1181-1186,共6页 中国科学(技术科学英文版)
基金 Supported by the National Natural Science Foundation of China (Grant No. 20573002) the Major State Basic Research Development Program of China (973Pprogram) (Grant No. 2001CB6105)
关键词 suspending NANOSTRUCTURE FABRICATION NANOIMPRINT lithography(NIL) ISOTROPIC reactive ion etching(RIE) suspending nanostructure fabrication nanoimprint lithography (NIL) isotropic reactive ion etching (RIE)
  • 相关文献

参考文献21

  • 1Brand O,Baltes H.Sensors. . 1998
  • 2Forsen E,Nilsson S G,Carlberg P,et al.Fabrication of cantilever based mass sensors integrated with CMOS using direct write laser lithography on resist. Nanotechnology . 2004
  • 3Abadal G,Boisen A,Davis Z J,et al.Combined laser and atomic force microscope lithography on aluminum:Mask fabrication for nanoelec- tromechanical systems. Applied Physics Letters . 1999
  • 4Abadal G,Davis Z J,Helbo B,et al.Electromechanical model of a resonating nano-cantilever-based sensor for high-resolution and high-sensitivity mass detection. Nanotechnology . 2001
  • 5Bartek M,Wolffenbuttel R F.Dry release of metal structures in oxy- gen plasma:process characterization and optimization. Journal of Micromechanics and Microengineering . 1998
  • 6Forsen E,Davis Z J,Dong M,et al.Dry release of suspended nanos- tructures. Microelect Eng . 2004
  • 7Hsu T R.MENS & Microsystems:Design and Manufacture. . 2004
  • 8Bustillo J M,Howe R T,Muller R S.Surface micromachining for microelectromechanical systems.Proceeding of The IEEE, 1998, 86(8), 15519. Craighead H G. Nanoelectromechanical systems. Science . 2000
  • 9A. Boisen,K. Birkelund,O. Hansen.Fabrication of submicron suspended structures by laser and atomic force microscopy lithography on aluminum combined with reactive ion etching, J. Journal of Vacuum Science and Technology . 1998
  • 10Z. J. Davis,G. Abadal,,O. Kuhn,O. Hansen,F. Grey,and A. Boisen.Fabrication and characterization of nanoresonating devices for mass detection. Journal of Vacuum Science Technology B Microelectronics and Nanometer Structures . 2000

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部