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Development of sintered Ni-Cu wicks for loop heat pipes 被引量:11

Development of sintered Ni-Cu wicks for loop heat pipes
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摘要 The present study fabricated a series of capillary wicks for loop heat pipes (LHPs), using two different methods, the cold-pressing sintering and direct loose sintering, and experimentally investigated the effect of different methods, compositions and sintering parameters on their properties in terms of porosity, permeability and pore radius. Porosity and pore radius were measured by the Archimedes method and Scanning Electron Microscope (SEM), respectively. Permeability of the wicks was compared by calculation using empirical equation. Results show that capillary wicks were successfully fabricated by using two different methods; the optimal capillary wick was found to be sintered at 650°C for 30 min, using direct loose sintering technique, with 90% nickel and 10% copper. The wicks could reach the porosity of 70.07% and the permeability of 10?13 m2 order, with mean pore radius of 0.54 μm.
出处 《Science China(Technological Sciences)》 SCIE EI CAS 2009年第6期1607-1612,共6页 中国科学(技术科学英文版)
基金 Supported by Shandong Provincial Program of Science and Technology Develop-ment(Grant No.2007GG1HZ06004)
关键词 loop heat pipe capillary wick SINTERING POROSITY PERMEABILITY pore radius loop heat pipe capillary wick sintering porosity permeability pore radiusxx
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  • 1Kaya T,Ku J.Thermal operational characteristics of a small-loop heat pipe. J Thermophys Heat Transfer . 2003
  • 2Hoang T,O’Connell T,Ku J,et al.Miniature loop heat pipes for electronic cooling. Proc IPACK03-Int Electron Packaging Tech Conf Exhib . 2003
  • 3Riehl R,Santos N.Loop heat pipe performance enhancement using primary wick with circumferential grooves. Applied Thermal Engineering . 2008
  • 4Joung W,Yu T,Lee J.Experimental study on the loop heat pipe with a planar bifacial wick structure. International Journal of Heat and Mass Transfer . 2008
  • 5Vasiliev L,Lossouarn D,Romestant C,et al.Loop heat pipe for cooling of high-power electronic components. International Journal of Heat and Mass Transfer . 2009
  • 6Magdonik Y F,Vershin S V,Korukov MA,et al.Minia-ture loop heat pipes-a promising means for cooling elec-tronics. IEEE Trans.Comp.Pack.Tech . 2005
  • 7Maydanik,YF.Loop heat pipes-review. Applied Thermal Engineering . 2005
  • 8Jentung Ku.Operating Characteristics of Loop Heat Pipes. In: 29th ICES, Denver, Colorado, America . 1999
  • 9Bergles A E.Evolution of cooling technology for electrical, electronic, and microelectronic equipment. IEEE Transactions on Components and Packaging Technologies . 2003
  • 10Krishnan S,Garimella S V,Chrysler G Met al.Towards a thermal Moore’s law. IEEE Transactions on advanced packaging . 2007

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