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Scaling Behaviors of Surface Roughening of Cu Thin Films Deposited by Oblique Angle Deposition

Scaling Behaviors of Surface Roughening of Cu Thin Films Deposited by Oblique Angle Deposition
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摘要 Cu thin films with different thicknesses were deposited by magnetron sputtering at various oblique angle θ of incidence between the deposition flux and the substrate surface normal.Cross-section microstructure and surface morphology of the films were investigated by scanning electron microscope(SEM)and atomic force microscope(AFM),respectively.Then the scaling behaviors of film surface roughening were analyzed in terms of dynamic scaling theory.With the increasing of the deposition angle θ,the angleφbetween grain growth direction and substrate surface normal increased gradually.With increasing θ in the range of<50°,the roughness exponent α increased from 0.76 to 0.82 and the growth exponent β decreased from 0.42 to 0.35.However,when θ increased to 70°,α and β changed to 0.72 to 0.61,respectively.The evolution of the scaling exponents effectively revealed the fact that the film surface roughening arises from the competition between surface diffusion and shadowing effect. Cu thin films with different thicknesses were deposited by magnetron sputtering at various oblique angle θ of incidence between the deposition flux and the substrate surface normal.Cross-section microstructure and surface morphology of the films were investigated by scanning electron microscope(SEM)and atomic force microscope(AFM),respectively.Then the scaling behaviors of film surface roughening were analyzed in terms of dynamic scaling theory.With the increasing of the deposition angle θ,the angleφbetween grain growth direction and substrate surface normal increased gradually.With increasing θ in the range of&lt;50°,the roughness exponent α increased from 0.76 to 0.82 and the growth exponent β decreased from 0.42 to 0.35.However,when θ increased to 70°,α and β changed to 0.72 to 0.61,respectively.The evolution of the scaling exponents effectively revealed the fact that the film surface roughening arises from the competition between surface diffusion and shadowing effect.
出处 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2012年第S1期93-96,共4页 Rare Metal Materials and Engineering
基金 NSFC(11075112,51101108) Specialized Research Fund for the Doctoral Program of Higher Education(new teachers,20100181120112) The National Basic Research Program of China(Grant No.2010CB631002)
关键词 CU THIN film surface SCALING OBLIQUE angle DEPOSITION Cu thin film surface scaling oblique angle deposition
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