期刊文献+

基于MEMS的悬板式风速传感器的研制

Fabrication of a Cantilever Plate Wind Speed Sensor Based on MEMS
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摘要 研制了一种基于体微机械加工技术的悬板式风速传感器.传感器由可动极板和固定极板构成,通过测量传感器的输出电容变化量来检测风速.基于流体力学原理对传感器进行了理论分析.将制作的传感器封装在印刷电路板(PCB)上,并置于小型风洞内进行测试.测试结果说明所研制的传感器能够实现0~15.5 m/s范围内的风速测量,风速越大,传感器的灵敏度越高.传感器的输出电容变化量和风速之间具有二次函数关系,与风速平方之间具有线性关系,线性度为8.1%. Based on bulk micromachining technology,a novel micro electro mechanical system(MEMS) based cantilever plate wind speed sensor was developed.The designed sensor consists of a movable plate and a fixed plate.The information of wind speed was obtained through detection of the output capacitance change of the sensor.The proposed sensor was analyzed based on fluid mechanics theory.The fabricated sensor was encapsulated on printed circuit board(PCB) and tested in a small wind tunnel.Test result shows that the sensor has a full scale measurable range from 0 m/s to 15.5 m/s as well as higher sensitivity in high wind speed.Moreover,there is a quadratic relationship between the capacitance change and the wind speed.There is also a linear relationship between the capacitance change and the square of wind speed,with the linearity of 8.1%.
出处 《纳米技术与精密工程》 EI CAS CSCD 2009年第5期423-427,共5页 Nanotechnology and Precision Engineering
关键词 风速传感器 悬板 微机械 电容 wind speed sensor cantilever plate micromachining capacitance
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参考文献10

  • 1许东华,张兆华,林惠旺,刘理天,任天令.硅玻璃阳极键合绝压压阻式压力传感器中的残余应力[J].功能材料与器件学报,2008,14(2):452-456. 被引量:6
  • 2高冬晖,秦明,程海洋,朱昊.一种基于CMOS工艺的二维风速传感器的设计和测试[J].固体电子学研究与进展,2006,26(1):96-99. 被引量:2
  • 3Matova S P,,Makinwa Kofi A A,Huijsing Johan H.Com-pensation of packing asymmetry in a 2-D wind sensor. IEEE Sensors Journal . 2003
  • 4Du Lidong,Zhao Zhan,Pang Cheng.Design and fabricationMEMS-based micro solid state cantilever wind speed sensor. Proceedings ofthe2007International Conference onInformation Acquisition . 2007
  • 5Ng K,Shajii K,Schmidt M A.A liquid shear stress sensorfabricated using wafer bonding technology. Proc Trans-ducers.USA . 1991
  • 6M.Laghrouche,A.Adane,J.Boussey,S.Ameur,D.Meunier,S.Tardu.A miniature silicon hot wire sensor for automatic wind speed measurements. Renewable Energy . 2005
  • 7Niklas Svendin,Edvard Kalvesten,G ran Stemme.A lift force sensor with integrated hot-chips for wide range flow measurements. Sensors and Actuators . 2003
  • 8Niklas Svedin,,Edvard K¨alvesten,and Goran Stemme.A New Edge-Detected Lift Force Flow Sensor. Journal ofMicroelectromechanical Systems . 2003
  • 9R. E. Oosterbroek,,T. S. J. Lammerink,,J. W. Berenschot,,G. J. M. Krijnen,,M. C. Elwenspoek.A micromachined pressure/flow-sensor. Sensor and Actuators . 1999
  • 10Lee G B,Kuo T Y,Wu W Y.A novel micromachined flow sensor using periodic flapping motion of a planar jet impinging on a V-shaped plate. Experimental Thermal and Fluid Science . 2002

二级参考文献12

  • 1Mailly F,Giani A,Bonnot R,et al.Anemometer with hot platinum thin film[J].Sensors and Actuators A,2001;94(1-2):32-38
  • 2Makinwa K A A,Huijsing J H,Hagedoorn A.Industrial design of a solid-state wind sensor[A].Sensor for Industry 2001 Proceedings of the First ISA/IEEE Conference[C].2001:68-71
  • 3Mayer F,Haberli A,Jacobs H.Single-chip CMOS anemometer [A].Electron Devices Meeting,1997 Technical Digest,International[C].1997:895-898
  • 4Kim Seunghy-un,Kim Sunghyun,Kim Yongduk,et al.Design and fabrication of a flow sensor detecting flowdirection and velocity [A].TRANSDUCERS,Solid-State Sensors,Actuators and Microsystems,12th Innational Conference on[C].2003;2:1 927-1 930
  • 5Van Oudheusden B W,Huising J H.An electronic wind meter based on a silicon flow sensor[J].Sensors and Actuators A,1990;21-23:420-424
  • 6Knowles K M, Van Helvoort A T J. Anodic bonding[ J]. International Materials Reviews, 2006, 51 ( 6 ) : 273 - 311.
  • 7Knowles K M, Van Helvoort A T J,Holmestad R,et al. Anodic oxidation during electrostatic bonding [ J ]. Philos. Mag, 2004, 84(6):505-519.
  • 8Xing Q F, Yoshida M, Sasaki G. TEM study of the interface of anodic - bonded Si/glass[ J ]. Scripta Materialia,2002, 47(9) :577 -582.
  • 9Eniko T Enikov, James G Boyd. A finite - element formulation for anodic bonding [ J ]. Smart Mater Struct, 2000, 9(6) :737 -750.
  • 10Yu P, Pan Ch, Xue J. The anodic bonding between K4 glass and Si [ J ]. Materials Letters, 2005, 59 : 2492 - 2495.

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