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含半椭圆型表面缺陷陶瓷材料的热冲击阻力分析

THERMAL SHOCK RESISTANCE ANALYSIS OF CERAMIC PLATE WITH SEMI-ELLIPTICAL SURFACE DEFECT
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摘要 本文研究一个有半椭圆型表面缺陷的陶瓷材料板的热冲击阻力问题.通过多项式形式的应力和几何形状因子得到半椭圆型表面裂纹尖端的热应力强度因子.以蓝宝石陶瓷板为例,基于最大应力准则和断裂韧性准则分析其热冲击阻力行为,并由这两个准则得到其强度计算中真实的热冲击阻力曲线. 本文研究一个有半椭圆型表面缺陷的陶瓷材料板的热冲击阻力问题.通过多项式形式的应力和几何形状因子得到半椭圆型表面裂纹尖端的热应力强度因子.以蓝宝石陶瓷板为例,基于最大应力准则和断裂韧性准则分析其热冲击阻力行为,并由这两个准则得到其强度计算中真实的热冲击阻力曲线.
出处 《固体力学学报》 CAS CSCD 北大核心 2011年第S1期25-30,共6页 Chinese Journal of Solid Mechanics
基金 国家自然科学基金(10972067 11172081)资助项目
关键词 热冲击 陶瓷 强度分析 断裂韧性 thermal shock ceramics strength analysis fracture toughness
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参考文献26

  • 1Yuezhong Feng Zhihe Jin.THERMAL FRACTURE OF FUNCTIONALLY GRADED PLATE WITH PARALLEL SURFACE CRACKS[J].Acta Mechanica Solida Sinica,2009,22(5):453-464. 被引量:1
  • 2陈梦成,张安哥,野田尚昭.平行于异材界面的三维椭圆平片裂纹分析[J].固体力学学报,2004,25(3):339-344. 被引量:1
  • 3陶伟明,郭乙木,曹志远.三维有限裂纹体分析[J].固体力学学报,2001,22(3):256-262. 被引量:3
  • 4Tohgo K,Iizuka M,Araki H,Shimamura Y.Influenceof microstructure on fracture toughness distributionin ceramic-metal functionally graded materials. Engineering Fracture Mechanics . 2008
  • 5Perl M,Greenberg Y.Three-dimensional analysis ofthermal shock effect on inner semi-elliptical surfacecracks in a cylindrical pressure vessel. International Journal of Fracture . 1999
  • 6Lee K Y,Kim J S.Determination of thermal shockstress intensity factor for elliptical crack by modifiedVainshtok’’s weight function method. EngineeringFracture Mechanics . 1997
  • 7Fan X J,Yu S W.Asymptotic solutions of transienttemperature and thermal stresses for a surface-cracked hollow cylinder subjected to thermal shock. Journal of Thermoelectricity . 1991
  • 8Lin C C,Hwu C.Uniform heat-flow disturbed by anelliptic rigid inclusion embedded in an anisotropic e-lastic matrix. Journal of Thermoelectricity . 1993
  • 9Noda NA,Kagita M.Variations of stress intensityfactors of a semi-elliptical surface crack subjected tomode I,II,III loading. International Journal ofPressure Vessels and Piping . 2004
  • 10Vodenitcharova T,Zhang L C,Zarudi I,Yin Y,DomyoH,Ho T,Sato M.The effect of anisotropy on the de-formation and fracture of sapphire wafers subjectedtothermal shocks. Journal of Materials Science Letters . 2007

二级参考文献54

  • 1[1]Erdogan F, Arin K. Penny-shaped interface crack between an elastic layer and a half-space. Int J Solid Structure, 1972, 8: 93~109
  • 2[2]Lee J C, Farris T N, Keer L M. Stress intensity factors for cracks of arbitry shape near an interface boundary. Engng Fract Mech, 1987, 27(1): 27~41
  • 3[3]Shibuya T et al. Stress analysis of the vicinity of an elliptical crack at the interface of two bonded half-spaces. JSME Int J, 1989, 32: 485~491
  • 4[4]Nakamura T. Three-dimensional stress fields of elastic interface cracks. ASME J Appl Mech, 1991, 58: 939~946
  • 5[7]Qin T Y, Noda N A. Analysis of a three-dimensional crack terminating at an interface using a hypersingular integral method. ASME J Appl Mech, 2002, 69: 626~631
  • 6[8]Chen M C, Noda N A, Tang R J. Application of finite-part integrals to planar interfacial fracture problems in three-dimensional bimaterials. ASME J Appl Mech, 1999, 66: 885~890
  • 7[9]Hadamard J. Lectures on Cauchys Problems in Linear Partial Differential Equations. New York: Dover Pub Inc, Mineola, 1952
  • 8Gupta,T.K.,Strength degradation and crack propagation in thermally shocked Al_20_3.Journal of the American Ceramic Society,1972,43:249-253.
  • 9Geyer,J.F.and Nemat-Nasser,S.,Experimental investigation of thermally induced interacting cracks in brittle solids.International Journal Solids and Structures,1982,18:349-356.
  • 10Bahr,H.A.,Fischer,G.and Weiss,H.J.,Thermal shock crack patterns explained by single and multiple crack growth.Journal of Materials Science,1986,21:2716-2720.

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