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钛化合物填充的聚合物导电复合材料的PTC特性及微观结构 被引量:4

PTC Characteristics and Microstructures of a Polymer Based Conductive Composite Filled with Various Titanium Compounds
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摘要 以高密度聚乙烯 (PE HD)及热固性环氧树脂为基体 ,钛的硼化物、碳化物、氮化物或碳氮化物为导电粒子 ,研究了PE HD/钛化合物、环氧树脂 /钛化合物导电复合体系的逾渗行为、PTC/NTC现象及微观结构行为。结果表明 ,PE HD/钛化合物及环氧树脂 /钛化合物导电复合体系均具有强PTC开关特性 ,其逾渗阀值为 3 5 %~ 65 % (体积分数 ) ;电阻温度系数高达 (5 5 .7%~ 64 .3 % )·℃ -1。钛化合物导电颗粒以粒度不等的非均匀分布分散在聚合物基体中 ,其中在PE HD基体中颗粒之间在室温下紧密接触导通 ;而在环氧树脂基体中颗粒之间易产生团聚。 The percolation behavior and PTC/NTC (positive temperature coefficient/negative temperature coefficient) characteristics of PE-HD/titanium compounds and epoxy resin/titanium compounds were investigated.Both systems showed an intensive PTC switch performance,the percolation threshold was between 35 vol% and 65 vol%,the resistance-temperature coefficient was between 55.7 %·℃ -1 and 64.3 %·℃ -1.The particle size of titanium compounds was widely distributed in the polymer matrix.They were more easily coagulated in epoxy resin than in PE-HD.
作者 罗延龄
出处 《中国塑料》 CAS CSCD 北大核心 2004年第5期43-46,共4页 China Plastics
关键词 钛化合物 接枝高密度聚乙烯 环氧树脂 正温度系数 偶联改性 微观结构 titanium compound grafted high density polyethylene epoxy resin positive temperature coefficient modification by coupling microstructure
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  • 1刘锋,周持兴,侯李明,王军.聚合物基正温度系数材料的研究进展[J].中国塑料,2005,19(3):7-12. 被引量:4
  • 2东建中,刘英.水雾化纯铜粉抗氧化性研究[J].粉末冶金工业,1995,5(2):57-59. 被引量:8
  • 3席军,刘廷华.PTC热敏电阻的开发应用现状[J].塑料,2005,34(4):79-84. 被引量:24
  • 4王炳喜,林航,林孟平.热处理N990炭黑及其PTC复合材料的电性能[J].电子元件与材料,2006,25(6):46-48. 被引量:3
  • 5Mather P J, Thomas K M. Carbon black/ high density polyethylene conducting composite materials [J]. J Mater Sci, 1997, 32:1711-1715.
  • 6Nicolaus Probst. Eusebiu Grivei. Structure and electrical properties of carbon black [J]. Carbon, 2002, 40:201-205.
  • 7Dana Pantea, Hans Darmstadt, Serge Kaliaguine, et al. Electrical conductivity of thermal carbon blacks influence of surface chemistry [J].Carbon, 2001,39:1147-1158.
  • 8Zhao Liren. High Temperature PTC Device and Conductive Polymer Composition [P]. United States Patent: 6090313,2000 - 7 - 18.
  • 9Wartenberg Mark F, Lahlouh John G, Toth James. Method of Making a Conductive Polymer Composition [P]. United States Patent : 5985976, 1999-11-16.
  • 10Sugaya Shoichi. PTC device[P]. United States Patent: 5280263,1994 - 01 - 18.

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