冲击拉伸下含孔高导无氧铜板中空穴增长与聚集的实验与数值研究

Experimental and Numerical Investigations of Void Growth and Coalescence in OFHC Sheets with Holes under Impact Tension

在Hopkinson拉伸试验装置及MTS试验机上,对包含多种构型空穴的高导无氧铜板以不同的拉伸速度进行了拉伸试验。空穴增长与聚集的实验结果分别与Brown-Embury模型、Thomason模型、McClintock模型的理论所预计结果作了比较。采用LS-DYNA程序对于典型试验也作了数值模拟,全过程考察了上述空穴聚集模型用于冲击拉伸载荷的可能性。结果表明:实验回收试件空穴的局部化应变大于数值模拟空穴聚集时的局部化应变;实验中试件的空穴已超过了空穴聚集的临界状态。

A series of tensile test for oxygen-free high conductive copper sheet with multi-configuration holes were carried out by the Hopkinson tensile and MTS test facilities at different tensile speeds.The experimented void growths and coalescences were compared with the theoretical predictions given by Brown-Embury,Thomason and McClintock models,respectively.The numerical simulations of the typical tests were performed by using LS-DYNA to investigate the application possibility of the above void coalescence models in impact tensile loading.The simulated and experimented results show that the void local strain of the recovered specimen is larger than that of the numerical simulation and the specimen void in the testing exceeds the critical state of void coalescence.