系统级封装中一种新型埋入式电源滤波结构的测量

The measurement of a Novel embedded power filter structure in System-in-Package

高密度小尺寸封装中通常需要多芯片共用一个电源网络,瞬态电流产生的电源噪声会降低系统的噪声容限,导致芯片误动作或通过供电网络干扰到临近敏感电路,产生信号完整性和电磁干扰问题。新型埋入式电源滤波结构代替传统的电源/地平面能够提供很低的电源阻抗(几十毫欧姆),在较宽的频带内隔离噪声。对这种极低阻抗结构的精确测量很容易受到信噪比以及夹具的重复性的影响,因此测量方法非常重要。本文针对新型电源滤波结构改进了测量方法,讨论了测量系统以及测量流程,并得到了比较好的测量结果。

Multi-chips in the System-in-Package/System-on-Package produce serious Simultaneous Switching Noise(SSN) or Ground Bounce Noise(GBN),which can reduce the noise margin of ICs,disturb circuitry and other sensitive devices nearby through interconnection structures and bring some signal integrity(SI) or electromagnetic interference(EMI) problems.The novel embedded low-pass filter can in place of the power/ground planes directly and provides power impedance as low as a few times ten milliohms. The ultra-low impedance measurement is limited by signal to noise ratio and fixturing reproducibility,so the measurement method is critically important for power distribution network(PDN) system.Based on this novel structure,the authors improved the measurement method,discussed the measurement system and measurement flows in this paper.The results from both measurement and simulation were matched well.