No-Flow半固化片固化过程及压合性能研究

Investigation on Curing Kinetics and Lamination Properties of No-Flow Prepreg

采用差示扫描量热法(DSC)研究了no-flow半固化片的固化过程,利用全动态DSC研究了该类型半固化片内树脂体系的固化反应动力学,通过经验方程的拟合获得了固化反应的动力学参数,并建立了固化反应动力学模型,通过模型分析确定了体系的固化工艺。用恒温DSC和动态DSC结合DiBenedetto方程研究了树脂玻璃化转变温度(Tg)和固化度之间的关系,并给出Tg和时间t及温度T之间的数学关系。通过DSC、TGA、SEM等研究了不同压合条件下固化体系的Tg值以及压合可靠性。实验结果表明,固化模型能较好地描述该P片的固化过程,固化程度不同,则材料均在Tg值、耐热性,粘结强度上表现出较大差异。

Curing process,curing reaction kinetics and thermal properties of no-flow prepregs were investigated by DSC at different heating rates.And the kinetics parameters were obtained by fitting methods from empirical equation,then the kinetics model was built.Curing process parameters were determined by curing model.Further the glass transition temperature(Tg) was investigated through isothermal or dynamic DSC combined with DiBenedetto equation.And thus the relationship between Tg and time and temperature was brought forward.The Tg and thermal reliability of products under different cure conditions were also studied,it is found that the curing model showed a good agreement with the actual process,difference in Tg,thermal stability and bonding power were found in different cure degree products.