摘要
本文介绍了新型材质缓冲垫板在覆铜板(CCL)层压生产中的应用情况,包括压力分散、厚度控制、基材质量等各个方面,并提出了层压垫板的应用前景及当前面临的困难与不足。
In this thesis,the performance of new kind of buffer cushion during CCL hot pressing is studied, including press dispersal,thickness control and quality of base material,etc.Furthermore,the application of buffer cushion for hot pressing and the difficulties also are researched.
出处
《印制电路信息》
2009年第S1期96-98,共3页
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