摘要
本文简单概述了目前业界多层板压合起皱现状。分析粘结片压合过程的热吸收过程以及粘度的变化,研究生产过程中实际升温速率、上压时间在工作窗中的最佳时间对于起皱的改善贡献度,以及高层次板在叠层结构、生产图形设计、层压时的叠板方式对改善贡献的探讨。
Imperfect appearance of crinkle of multilayer printed circuit boards is analyzed in this article generally.Thermal absorption and combination diversification of prepreg conjunction during pressing process are taken into consideration.The heating rate and pressing continuous time are investigated to optimize the corrective conditions of crinkle.The critical factors of lay-up structure,circuits design,and boards' arrangement during fabrication are also researched.
出处
《印制电路信息》
2009年第S1期105-110,共6页
Printed Circuit Information
关键词
压合
铜箔起皱
升温速率
上压时间
叠层方式
生产图形设计
Pressing
crinkle
heating rate
heating rate
Pressing continuous time,lay-up structure,circuits design
