微孔质量改善

Via Quality Improvement

本文主要叙述盲孔加工过程中所遇困难、对盲孔孔加工缺陷的研究及其改善,分析影响盲孔质量的多种因素,如:表面处理技术、底铜质量及pp均匀性对盲孔电气性能的影响。

This thesis dissertates the difficulty of laser drill,studies the disfigurement of laser drill and improvement.It also analyzes some factors which influence the Via quality,such as:Surface treatment、bottom-pad and PP-equable,all the serious influence section for Via electric capability.