电镀铜分散能力的研究

The Research of Plating Copper Diffusion

电镀铜分散能力的研究对于PCB制造具有深刻而深远的作用,电镀铜的效果直接影响着线路形成过程,对于高密度互联(HDI)产品,严格控制电镀铜流程,保证电镀铜质量至关重要。电镀铜分散能力的好坏一般使用COV来衡量,业界一般将COV控制在10%以下。本文电镀分散能力的研究围绕电镀设备和电镀药液两方面展开,通过调整电镀设备及药液成分组成,得到稳定的沉积速率,进而得到平整的镀层结构;同时从理论分析及研究方法方面进行相关剖析。

The research of plating copper diffusion has profound and far-reaching effect on PCB production. The effect of plating copper influence the forming conductive pattern directly,so strictly controlling plating copper and insuring the quality of plating copper is quite important to HDI.COV is used to measure plating copper diffusion,and the COV is usually controlled minus 10%.This article studies the plating diffusion surrounding plating equipment and plating liquid,through adjusting plating equipment and bath components to insure an steady plating rate,thereby to get even layer;at the same time from theory analysis and research method to construe.