盲孔无铜之树脂杂物空洞分析

Analysis of No Copper in Blind-via Resulting in Resin Void

盲孔无铜是HDI板件中常见的一种缺陷。盲孔无铜产生的原因包括电镀、钻孔及杂物等,需要找出具体的原因分类进行针对改善,树脂杂物空洞也是影响因素之一。本文通过对发生树脂杂物空洞的盲孔无铜实例分析来寻找杂物源头及进行过程改善。

Blind Hole HDI board without pieces of copper is a common defect.The reason for blind hole without copper includes copper plating,drilling and other debris factors.It is needed to identify the specific reasons for the improvement of classification.Empty resin debris is one of the influencing factors.In this paper,it discussed what happened during the period of the resin of a hollow blind holes debris-free copper case,tried to find the source of debris and provide process improvement.