光PCB板电测与激光打标技术

Bare PCB E-Test and Laser Marking Technology

在激光技术产生以来的50多年时间里,激光技术在世界范围内的工业加工领域都获得了广泛的应用。在我国,亦在工业生产、通信及医疗等各个领域广泛应用。随着技术的不断进步和人们需求的不断提高,电子产品逐步朝向轻、薄、短、小的方向发展。激光具有单色性好,相干性好,方向性好,高亮度的特点,激光加工与传统的加工方法比较,具有清洁、高效、精细、柔性便捷的特点,激光在PCB行业的应用亦越来越广。激光标记技术与电测技术相结合,是PCB行业的另一发展趋势,特别是在HDI及IC载板的应用方面。通过电测线与激光标记线的无缝集成,激光打标机直接从电测线读取电测数据并进行标记,既方便了对制程的管制,又方便了提升贴片制程的效率及避免浪费降低成本。

In the developing fifty years of Laser technology,it is widely used in worldwide industry.It is also widely used in industry、communicate、medical,and so on in china.With the developed of technology and the desirous express of quality and strong function,electrical product need more and more light、thin、short and small.Laser has the characters of monochromaticity、cohence、directionality、high brightness, compared with conventional processing method,laser processing has the characters of clear、high efficiency、fine、flexbility,is widely used in PCB industry area.Bare PCB E-Testing technology integrated with laser marking technology is an another tendency of PCB industry,especially in HDI and IC substrate. By means of seamless integration,Laser marking system get the data from E-Testing system directly,it is easy to control PCB quality and increase the efficiency of SMT,decrease the cost.