摘要
系统PCB的发展趋势之一就是高密小型化,尤其随着1.0与0.8mm PITCH BGA在系统板上的广泛使用,孔与孔之间的距离越来越近。在PCB的CAF失效模式中,孔孔失效是最主要的一种,因此,系统PCB必须关注CAF风险。本文主要从PCB板材的选择、设计的优化、制程的改善等方面来降低CAF风险。
High density and miniaturization are the trends of systemic boards,especially when 1.0mm&0.8mm pitch BGAs are widely applied.The distance between holes should be closer.CAF between holes is the main failure mode,therefore,systemic board must focus on the risk of CAF.This paper focuses on how to reduce CAF risk,such as material choice,board design optimization,process improving,etc.
出处
《印制电路信息》
2009年第S1期363-370,共8页
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