不同金镍厚板件性能测试试验
Test of Different Thickness of Gold and Nickel
摘要
本文通过讨论实验条件、实验过程以及最后的结果来验证不同金镍厚板件性能以提升产品的质量。
This article discussed the test conditions,the test process and the final result to prove the impact of different thickness of gold on printed circuit board performance and quality.
出处
《印制电路信息》
2009年第S1期411-417,共7页
Printed Circuit Information