快压覆盖膜填胶过程研究

Investigation on Resin Flow and Gap Filling of Coverylay in Fast-lamination

挠性板生产过程中,层压填胶覆形是最重要的步骤之一。本文通过快压填胶试验研究了覆盖膜的PI层厚度、胶层厚度、线路铜厚、线距、层压参数、PE覆形等对板间线路填充效果的影响,并结合缺陷图片对树脂流动行为作了初步分析,指出填胶缺陷形成原因,对FPC压合材料的选择、工艺参数的优化具有一定的指导意义。

Filling the line gaps and conforming FPC is always one of the vital steps in FPC producing process.Effect of thickness of PI film and adhesive,copper thickness,line space,press parameters and PE conforming on resin filling in the space between circuitry were researched through fast-laminating experiments in this article.Based on the irregularity picture,the article discussed the resin flow behavior and pointed out the cause briefly.It has special guiding significance to selection of material and optimization of technics of FPC.