压制增强板的参数优化

Suppression Parameters Optimization of Stiffener Board

在挠性印制电路领域,增强板用于对挠性薄膜基板的支撑,以方便于印制板的连接,固定,插装元器件和其他功能。因此增强板在挠性印制电路中起着不可替代的作用。通常使用的增强板是由PI材料制成的,虽然PI材料拥有诸多的优点,但在其与挠性板压制的过程中存在诸多的问题,最主要的问题就是压合后的结合力不够.为了增强结合力,本文利用均匀设计方法安排试验,找到获得最佳试验参数,并得出拟合实验方程以实现最优化生产。在该试验参数下产生的结合力是平常效果的2到3倍,达到良好的生产效果,并为进一步的理论分析做铺垫。

Stiffener board was used to hold up substrate of flex film in order to facilitate the connection, fixation,ACI component insertion and other functions of PCB in the Flexible printed circuit Board field. Therefore,the stiffener board played an irreplaceable role in the flexible printed circuit board.The general stiffener board was made from PI materials,Although the PI materials have many advantages,but there are many issues in the course of Flexible Board pressing,in particular,the main issue is that the bonding force is not enough after pressing.So as to strengthen bonding force,Uniform Design method is taken advantage of to arrange experiment,then the optimal test parameters could be obtained,and the fitting experiment equation was drawn to realize the optimized production and pave the way for the further theoretical research.the bonding force generated Under these test parameters was 3～4 times as that of the normal circumstances,so the good results of production have already achieved.