非对称PCB翘曲分析及改善

Analysis and Reform on Non Symmetry Structure PCB

本文利用模型分析了非对称结构PCB板在压合及喷锡加工过程中产生翘曲的机理,根据翘曲机理创新出一种选择性非对称传热方式压合,在试验及批量生产中对PCB板件的翘曲改善起到了明显效果。

This paper analyzed reasons of non symmetry PCB's warp by studying on warp model mechanism that happened in the lamination and HALS.It created the non symmetry heat exchange through the lamination process.The examining results show the non symmetry heat exchange lamination can improve PCB's warp.