挠性电路板技术的现状和发展趋势

Current Situation and Development Trend of Flexible Circuit Board Technology

文章论述了挠性电路板技术的现状,由于无粘结层挠性覆铜箔基材和感光显影型保护膜的成功开发和应用,使挠性电路板的生产走上了可量产化的轨道。指出现有挠性电路板的制造技术是制约挠性电路板技术发展的瓶颈。目前挠性电路板技术的广泛应用仍面临着一些困难,在不久的将来,感光显影型覆盖层的开发和应用,会给挠性电路板技术的发展带来巨大的变化,它具有广阔的应用前景,必将在市场上大放异彩。

In this paper,the current situation of flexible circuit board technology is described.As the successful developing and application of non-cohesive layer of flexible with copper foil parent metal and protection layer with sensitive developing type,the production of flexible circuit board can be embarked on mass production orbit.The paper points out that the bottle neck to restrain the development of flexible circuit board is current production technology of flexible circuit board.Currently the wide application of flexible circuit board technology still has some difficulties.In the near future,the development and application of protection layer with sensitive developing type will give a great change to the developing of flexible circuit board.It has a wide application prospects,will certainly shine in the market.