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Thermal performance of heat pipe with different micro-groove structures 被引量:1

Thermal performance of heat pipe with different micro-groove structures
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摘要 Four kinds of micro heat pipe of trapezoidal groove wick structure with different numbers of grooves or aspect ratios were studied and compared about thermal transfer performances in order to optimize the manufacture of micro heat pipe with groove wick structure. The results show that these micro heat pipes have excellent performance in heat transfer; the equivalent thermal conductivity coefficient is two orders of magnitude compared with that of copper; the number and aspect ratio of grooves have a prominent effect on the performance of such thermal transfer. The optimum number of grooves is lower than 60 and the best aspect ratio is near to 1.5. The temperature and thermal transport rate are almost directly proportional relationship, but this relationship will be broken up suddenly when the critical heat flux is reached. Four kinds of micro heat pipe of trapezoidal groove wick structure with different numbers of grooves or aspect ratios were studied and compared about thermal transfer performances in order to optimize the manufacture of micro heat pipe with groove wick structure. The results show that these micro heat pipes have excellent performance in heat transfer; the equivalent thermal conductivity coefficient is two orders of magnitude compared with that of copper; the number and aspect ratio of grooves have a prominent effect on the performance of such thermal transfer. The optimum number of grooves is lower than 60 and the best aspect ratio is near to 1.5. The temperature and thermal transport rate are almost directly proportional relationship, but this relationship will be broken up suddenly when the critical heat flux is reached.
出处 《Journal of Central South University》 SCIE EI CAS 2008年第S2期240-244,共5页 中南大学学报(英文版)
基金 Projects(50605023 50436010) supported by the National Natural Science Foundation of China
关键词 HEAT PIPE micro CHANNEL ELECTRONIC HEAT DISSIPATION HEAT TRANSFER heat pipe micro channel electronic heat dissipation heat transfer
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  • 1ZHOU Jie min 1, YANG Ying 1, DENG Sheng xiang 1, YI Zheng ming 1, WANG Xi tao 2, CHEN Liu 2, Johan Liu 2 (1.Department of Applied Physics and Heat Engineering, Central South University, Changsha 410083, China,2.Department of Production En.Heat transfer in high density electronics packaging[J].Journal of Central South University of Technology,2001,8(4):278-282. 被引量:2
  • 2OOMI M,FUKUMOTO T,SOTANI T.A heat-pipe system for cooling a desktop computer. Adv Eectron Packaging . 1999
  • 3BABIN B R,PETERSON G P,WU D.Analysis and testing of a micro heat pipe during steady-state operation. Proceedings of ASME/AICHE National Heat Transfer Conference . 1989
  • 4ENGINEERING B K.Summary report for axially grooved heat pipe study. NASA Contract No. NAS5-22562 . 1977
  • 5LI Yong,TANG Yong,XIAO Buo-wu.Manufacturing of inner micro grooves of copper heat pipe via high-speed oil-filled spinning. J South China University of Technology: Natural Science Edition . 2007
  • 6Khrustalev D,Faghri A.Thermal analysis of a micro heat pipe. ASME Journal of Heat Transfer . 1994
  • 7Cotter T P.Principles and Prospects for Micro Heat Pipes. Proceedings of5th International Heat Pipe Conference . 1984
  • 8Wu D,Peterson G P.Investigation of the transient characteristics of a micro heat pipe. AIAA J. Thermophysics and Heat Transfer . 1991
  • 9N. Zhu and K. Vafai.Analysis of cylindrical heat pipes incorporating the effects of liquid–vapor coupling and non-Darcian transport—a closed form solution. International Journal of Heat and Mass Transfer . 1999
  • 10SUNG J K,,JOUNG K S,KYU H D.Analytical andexperimental investigation on the operational characteris-tics and the thermal optimization of a miniature heatpipe with a grooved wick structure. InternationalJournal of Heat and Mass Transfer . 2003

二级参考文献8

  • 1Willander M and Hartnagel H L.High temperature electronics[]..1997
  • 2Johan Liu,Wang C P.Development of a 3D substrate for repairable high density interconnection system packaging ( an international research consortium)[]..2000
  • 3Greiner M,Faulkner R. T,Wirtz R A,et al.Simulation of 3-D flow and argument heat transfer in a symmetrically grooved channel with constant temperature walls[].American Society of Mechanical Engineers (Heat transfer division).1997
  • 4Sinnandurai F N.Handbook of microelectronics packaging and interconnection technology[]..1985
  • 5Charles A Harper,Ronald M Samposon.Electronic materials and process handbook[]..1994
  • 6Johan Liu.Conductive adhesives for electro-nics packaging[]..1999
  • 7Johan Liu,Wang C P,Johan L Prince,et al.Electronics packaging design, materials, process and reliability[]..1999
  • 8T Y Lee.An investigation of thermal enhancement on flip chip plastic BGA packaging using CFD tool[].IEEE Transactions on Components and Technologies.2000

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