先进IC封装的分析技术

本文对微电子FC、BGA、COB、TAB、MCM、CSP等几种先进的封装技术进行了概述,介绍了封装材料、工艺及失效分析的工具和方法。

The article reviews microelectronics packaging technologies, especially some advanced ones, such as FC, BGA, COB, TAB, MCM, CSP, etc. , and introduces some newly developed analysis tools and methods for the packaging materials, process and failure analysis as well..