摘要
The interface adhesion strength(or interface toughness)of a thin film/substrate system is often assessed by the micro-scratch test.For a brittle film material,the interface adhesion strength is easily obtained through measuring the scratch driving forces.However,to measure the interface adhesion strength(or in- terface toughness)for a metal thin film material(the ductile material)by the micro- scratch test is very difficult,because intense plastic deformation is involved and the problem is a three-dimensional elastic-plastic one.In the present research,using a double-cohesive zone model,the failure characteristics of the thin film/substrate system can be described and further simulated.For a steady-state scratching pro- cess,a three-dimensional elastic-plastic finite element method based on the double cohesive zone model is developed and adopted,and the steady-state fracture work of the total system is calculated.The parameter relations between the horizontal driving forces(or energy release rate of the scratching process)and the separation strength of thin film/substrate interface,and the material shear strength,as well as the material parameters are developed.Furthermore,a scratch experiment for the Al/Si film/substrate system is carried out and the failure mechanisms are explored. Finally,the prediction results are applied to a scratch experiment for the Pt/NiO material system given in the literature.
The interface adhesion strength(or interface toughness)of a thin film/substrate system is often assessed by the micro-scratch test.For a brittle film material,the interface adhesion strength is easily obtained through measuring the scratch driving forces.However,to measure the interface adhesion strength(or in- terface toughness)for a metal thin film material(the ductile material)by the micro- scratch test is very difficult,because intense plastic deformation is involved and the problem is a three-dimensional elastic-plastic one.In the present research,using a double-cohesive zone model,the failure characteristics of the thin film/substrate system can be described and further simulated.For a steady-state scratching pro- cess,a three-dimensional elastic-plastic finite element method based on the double cohesive zone model is developed and adopted,and the steady-state fracture work of the total system is calculated.The parameter relations between the horizontal driving forces(or energy release rate of the scratching process)and the separation strength of thin film/substrate interface,and the material shear strength,as well as the material parameters are developed.Furthermore,a scratch experiment for the Al/Si film/substrate system is carried out and the failure mechanisms are explored. Finally,the prediction results are applied to a scratch experiment for the Pt/NiO material system given in the literature.
基金
The project supported by the National Natural Science Foundation of China (19891180 and 19925211)
Bai Ren Plan of CAS
