摘要
The thermal stress of the quartz oscillator module packaging isinvestigated using digital-im- age correlation method (DICM), and theexperimental results are given. Under the quartz oscillator modulepackaging, the quartz oscillator and the Fe-Sn-Cu alloy frame arejoined together with the electroconductive adhesive (PI), and theelectroconductive adhesive needs to be cured twice at 150 deg. C and275 deg. C respective- ly.
The thermal stress of the quartz oscillator module packaging isinvestigated using digital-im- age correlation method (DICM), and theexperimental results are given. Under the quartz oscillator modulepackaging, the quartz oscillator and the Fe-Sn-Cu alloy frame arejoined together with the electroconductive adhesive (PI), and theelectroconductive adhesive needs to be cured twice at 150 deg. C and275 deg. C respective- ly.
基金
the Natural Science Foundation of Tianjin (013605211)
