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Cyclic Deformation and Fatigue Damage Behavior of Cu Monocrystals, Bicrystals and Tricrystals 被引量:1

Cyclic Deformation and Fatigue Damage Behavior of Cu Monocrystals, Bicrystals and Tricrystals
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摘要 In the present work, the cyclic deformation behavior of Cu single crystals oriented for double- and multiple slip as well as Cu bicrystals and tricrystals was investigated under constant plastic strain control at room temperature in air. The main objectives of the study are: (1) to find out the effects of crystallographic orientation and grain boundary (GB) on the cyclic stress-strain (CSS) curves; (2) to compare the cyclic deformation behavior of the double-, multiple-slip crystals, bicrystals and tricrystals with that of single-slip oriented crystals and to correlate the results with those of polycrystals; (3) to examine the corresponding dislocation structures; (4) to investigate the interactions of persistent slip bands (PSBs) with GBs and triple joint (TJ) as well as intergranular fatigue cracking in Cu bicrystals and tricrystals. In the present work, the cyclic deformation behavior of Cu single crystals oriented for double- and multiple slip as well as Cu bicrystals and tricrystals was investigated under constant plastic strain control at room temperature in air. The main objectives of the study are: (1) to find out the effects of crystallographic orientation and grain boundary (GB) on the cyclic stress-strain (CSS) curves; (2) to compare the cyclic deformation behavior of the double-, multiple-slip crystals, bicrystals and tricrystals with that of single-slip oriented crystals and to correlate the results with those of polycrystals; (3) to examine the corresponding dislocation structures; (4) to investigate the interactions of persistent slip bands (PSBs) with GBs and triple joint (TJ) as well as intergranular fatigue cracking in Cu bicrystals and tricrystals.
机构地区 Chinese Acad Sci
出处 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 1999年第6期489-508,共20页 材料科学技术(英文版)
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