摘要
In addition to the study of thermal stress behavior, the stress relaxation at elevated temperature (205 degree C) was also investigated by means of X-ray diffraction. It was found that the elastic and elastoplastic deformation in the 6061 Al layer takes place during thermal cycling, and the same closed stress temperature loop is formed in the second cycling for the aged and low temperature treated specimen. Meanwhile, it was demonstrated that the compressive stress relaxed in 6061 Al layer at 205 degree C within the range of 0.5-16 h, and which is nearly unchanged with further prolongation of time. (Edited author abstract) 19 Refs.
In addition to the study of thermal stress behavior, the stress relaxation at elevated temperature (205 degree C) was also investigated by means of X-ray diffraction. It was found that the elastic and elastoplastic deformation in the 6061 Al layer takes place during thermal cycling, and the same closed stress temperature loop is formed in the second cycling for the aged and low temperature treated specimen. Meanwhile, it was demonstrated that the compressive stress relaxed in 6061 Al layer at 205 degree C within the range of 0.5-16 h, and which is nearly unchanged with further prolongation of time. (Edited author abstract) 19 Refs.
