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Thermal Stress Behavior of Diffusion-bonded SiC/6061Al Laminates during Thermal Cycling

Thermal Stress Behavior of Diffusion-bonded SiC/6061Al Laminates during Thermal Cycling
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摘要 除了热压力行为的学习,在提高的温度(205 度 C ) 的压力松驰也借助于 X- 被调查 -- 光线衍射。在 6061 艾尔层的橡皮和 elastoplastic 变丑发生在热骑车期间,这被发现,并且一样关上了压力温度循环在第二被形成为年老、低的温度骑车对待的标本。同时,压缩应力在 0.5-16 h 的范围以内在 205 度 C 在 6061 艾尔层放松了,这被表明,并且它与时间的进一步的延伸是将近未改变的。(编辑作者摘要) 19 个裁判员。 In addition to the study of thermal stress behavior, the stress relaxation at elevated temperature (205 degree C) was also investigated by means of X- ray diffraction. It was found that the elastic and elastoplastic deformation in the 6061 Al layer takes place during thermal cycling, and the same closed stress temperature loop is formed in the second cycling for the aged and low temperature treated specimen. Meanwhile, it was demonstrated that the compressive stress relaxed in 6061 Al layer at 205 degree C within the range of 0.5-16 h, and which is nearly unchanged with further prolongation of time. (Edited author abstract) 19 Refs.
出处 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 1999年第2期117-120,共4页 材料科学技术(英文版)
关键词 AL SIC
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