INTERFACIAL REACTIONS OF METAL FILMS WITH AlN SUBSTRATE

ＩＮＴＥＲＦＡＣＩＡＬＲＥＡＣＴＩＯＮＳＯＦＭＥＴＡＬＦＩＬＭＳＷＩＴＨＡｌＮＳＵＢＳＴＲＡＴＥＨｅＸｉａｎｇｊｕｎ；ＴａｏＫｕｎ；ＦａｎＹｕｄｉａｎ（ＤｅｐａｒｔｍｅｎｔｏｆＭａｔｅｒｉａｌｓＳｃｉｅｎｃｅａｎｄＥｎｇｉｎｅｅｒｉｎｇ，Ｔｓｉｎｇｈ...

Thin films of Ti and Ni deposited on AlN substrate by e-gun evaporation were annealed at the temperatures from 600℃ to 800℃ and from 600℃ to 850℃ for 1 h respectively. Solid-state reaction products between the metal films and AlN substrate under annealing were investigated by X-ray diffraction (XRD)and Ruthford backscattering spectrometry(RBS). TiAl3 TiN, and Ti4N3-x including Ti2N were found at the interface between Ti film and AlN substrate for the annealed samples. In Ni/AlN system, NiAl3 and Ni3N were formed at the interface between Ni thin film and AlN substrate for the samples annealed above 600℃.NiAl3 formed at the interface was very dense and hindered the diffusion of Al and N atoms into Ni thin films.As a result, the interface reaction was limited in the vicinity of the interface region.