摘要
The influences of additive elements on properties of gold wire and the technology of homogeneously adding those elements to gold matrix were studied. A BJ-type gold bonding wire for automatic bonders was developed, which has high bond strength and stable uniform mechanical properties and is capable of forming good spherical shape of melting-ball observed by SEM. The bonding wire is fully suitable to the requirements of the automatic bonding technology and satisfies the performance requirement of IC products.
The influences of additive elements on properties of gold wire and the technology of homogeneously adding those elements to gold matrix were studied. A BJ-type gold bonding wire for automatic bonders was developed, which has high bond strength and stable uniform mechanical properties and is capable of forming good spherical shape of melting-ball observed by SEM. The bonding wire is fully suitable to the requirements of the automatic bonding technology and satisfies the performance requirement of IC products.
