耐热光敏聚酰亚胺的光刻工艺研究

STUDY OF THE PHOTOLITHOGRAPHY TECHNIQUE OF THERMALLY STABLE PHOTOSENSITIVE POLYIMIDE

本文主要研究了国产耐热光敏聚酰亚胺树脂的光刻工艺的各种参数。利用微机技术和高分子溶度参数相近原理,研制成了理想的显影液,通过大量实验,确定了最佳工艺条件。该技术的分辨率达到亚微米,灵敏度为50～80mJ/cm^2,留膜率可达90%以上,工艺稳定性和重复性好,可用于生产中。

Various parameters of the lithographic processing of the home-made photosensitive polyi-mide are studied. The ideal developer has been investigated by using microcomputer and thesimilitude principle of the solubility parameter of high polymer molecular. The optimumprocessing condition is determined through volume experiments. The resolution of this techniquehas reached submicron, with sensitivity of 5～80mJ/cm^2. The percent thickness remained after development can be as high as 90%. The stability and reproduction quality have made it possible to be used in the production.