摘要
覆铜板(CCL)作为印制电路板的重要原材料,其性能与质量直接制约着电子产品制造技术、电子安装技术的发展。为此,论文总结了本研发团队近期公开发表的覆铜板制造设备相关专利的创新内容及思路,以期对我国CCL制造业界有所借鉴和启发。
Copper clad laminate is the fundamental materials of printed circuit board, which plays a pivotal role in manufacturing technology of electronic products as well as electronic installation technology. In order to share the ideas of innovation or improvement on copper clad laminate with other corporations, the patents related to equipments for copper clad laminate processing issued from our team recently are summarized, and the contents and ideas of those patents are analyzed and elaborated.
出处
《印制电路信息》
2013年第S1期6-10,共5页
Printed Circuit Information
基金
广东省教育部产学研项目(项目编号:2012A090200007)的资助
关键词
覆铜板
印制电路板
半固化片
设备改进
Copper Clad Laminate
Printed Circuit Board
Prepreg
Equipment Improvement
