摘要
LED散热基板用的高导热金属基覆铜板作为LED的重要原材料,其品质对LED的品质及寿命有着决定性影响,而其由于与传统FR-4基板在结构上有明显差异,因此其制程的工艺控制也有所不同。文章将介绍LED散热基板用高导热金属基覆铜板的工艺控制关键点。
As an important raw material used for manufacturing of LED radiating substrates, high thermal conductivity of Metal based copper clad laminate affects the key quality and life of LED. Because of its significant different structure with traditional FR-4, there is also a different process control. This article will introduce the key points of process control for high thermal conductivity of Metal based CCL used in manufacturing LED radiating.
出处
《印制电路信息》
2013年第S1期28-31,共4页
Printed Circuit Information
关键词
覆铜板
发光二极管
填料
导热率
Copper Clad Laminate
Light Emitting Diode
Filler
Thermal Conductivity
